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Description / Abstract:
Volume 10.04 covers standards on electronics, including:
• Innerlayer interconnections and bonding
• Materials and processes for vacuum tubes
• Electronic device characterization
• Hermetic seals
• Hybrid circuits and substrates
• Microelectronic packaging
• Leak testing
• And more
This volume also includes the latest standards relating to
• Declarable substances in materials •3D imaging systems •Additive manufacturing technologies